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Finetech Presents Next-Generation Die Bonding Solutions at Productronica 2025
At this year’s Productronica (November 18–21, 2025), Finetech GmbH & Co. KG invites visitors to discover the future of precision die bonding and micro-assembly in Hall B2, Booth 405.
10 月 23, 2025
Finetech Showcases the Fastest FINEPLACER® Yet at LASER World of PHOTONICS 2025
Finetech announces the debut of its fastest production die bonder to date at LASER World of PHOTONICS 2025.
6 月 25, 2025
Martin GmbH Ceases Operations – Finetech and Mexser Ensure Continuity
After many successful years as a subsidiary of Finetech, Martin GmbH will cease operations in May 2025.
3 月 13, 2025
FINEPLACER® femto pro – The Efficient Solution for Advanced Packaging
Finetech introduces the FINEPLACER® femto pro, the next-generation automated die bonder for high-yield and sustainable mid-volume production.
2 月 26, 2025
Finetech to Demonstrate Advanced Die Bonding Solutions at Photonics West 2025
Finetech announced its participation in Photonics West 2025, the world’s premier photonics technologies event, taking place in San Francisco from January 28-30.
1 月 23, 2025
