Finetech Presents Next-Generation Die Bonding Solutions at Productronica 2025

At this year’s Productronica (November 18–21, 2025), Finetech GmbH & Co. KG invites visitors to discover the future of precision die bonding and micro-assembly in Hall B2, Booth 405.

With over 30 years of engineering excellence, Finetech is positioned to provide tailored equipment and process solutions across the entire die packaging value chain – supporting customers along the complete journey from feasibility and prototyping to full-scale production and long-term lifecycle support.

Exclusive Preview: Next-Generation Production Platform

A key highlight will be an exclusive first look at Finetech’s new production platform, currently in development for high-volume die bonding applications.

The system features automated wafer and die handling on a high-precision gantry, enabling efficient, repeatable workflows and supporting scalable manufacturing. It is being designed to incorporate ultrasonic bonding as its initial process capability and provides an open platform architecture to accommodate diverse process requirements.

Visitors will have the opportunity to preview the concept and share direct feedback, helping to shape the platform’s final design.

Live Demonstrations & Expert Insights

Visitors can experience live demos of Finetech’s flagship systems, including:

In addition, Finetech’s experts will present at the Productronica Forum (A1.105) on Wednesday, November 19, 2025, sharing insights on how advanced die bonding is enabling quantum-enabled packaging and next-generation photonic systems.

Why Visit Finetech

  • See the latest bonding processes live on our flagship die bonders
  • Get a first preview of our upcoming production platform
  • Share feedback directly with Finetech engineers and influence future developments
  • Gain insights into trends in semiconductor and quantum packaging
  • Learn how we support customers from prototype to production with tailored process and equipment solutions

Visit Finetech in Hall B2, Booth 405.

Learn more: www.finetech.de/productronica25

Contact Us

Related Information

Contact Us

If you have a service request, please click here.

此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。
此栏为必填项。