Berlin, June 2025 – Finetech, a global leader in precision die bonding solutions, proudly announces the debut of its fastest production die bonder to date — the FINEPLACER® femto pro — at LASER World of PHOTONICS 2025.
Setting a new benchmark in high-precision micro-assembly, the FINEPLACER® femto pro combines unmatched bonding speed with the renowned accuracy of the FINEPLACER® femto platform. Designed for high-throughput production environments, this cutting-edge system delivers a future-proof solution for advanced packaging applications, including Silicon Photonics, Photonic Integrated Circuits, Co-Packaged Optics, and Quantum Photonics.
“With over 30 years of experience, we continue to push the boundaries of precision bonding,” says Martin Rogge, Head of Product Management at Finetech. “The FINEPLACER® femto pro is our response to the growing need for performance, flexibility, and cost-efficiency in photonics production.”
Key Highlights at the Show:
- Live Demonstrations of the FINEPLACER® femto pro in action
- Insights into the system’s reduced cost-per-bond and significantly increased throughput
- Personalized consultations to explore tailored configurations and upgrade paths
Engineered for scalability, the femto pro adapts effortlessly to evolving production needs — ensuring long-term value and reliable performance across the full product lifecycle.
Additionally, Finetech will showcase the FINEPLACER® lambda 2, the ideal tool for R&D and prototyping. Designed for ultimate process flexibility and sub-micron accuracy, the FINEPLACER® lambda 2 provides hands-on control for the development of next-generation micro-assembly applications in a compact, modular form.
Visit Finetech at LASER World of PHOTONICS 2025 on Booth B2.414
Experience the latest innovations in die bonding firsthand and discover how our modular, customer-driven platforms support your journey — from prototype to production.
Book your live demo today and be among the first to witness the fastest FINEPLACER® ever built for production.
