The modular platform supports multiple bonding technologies and 12-inch wafers, enabling manufacturers to consolidate diverse advanced packaging processes in one system.
The new automated production die bonder is built to deliver stable, repeatable assembly workflows through a flexible architecture that supports C2S, CoB, C2C and C2W processes, using 12-inch wafers as both source and target. By combining these capabilities, it gives semiconductor, photonics and sensor manufacturers a unified platform for handling demanding applications in advanced 2.5D and 3D packaging, heterogeneous integration, as well as hybrid bonding and direct bonding.
Development of the platform continues to evolve in response to customer input and real production requirements. Rising expectations for yield, quality and reliable high-volume output are driving the need for scalable, automation-ready production tools that can support new materials and increasingly complex assembly hierarchies.
“As the boundaries of semiconductor and photonics design continue to shift, manufacturers need production platforms that can evolve just as quickly. This beta prototype is a milestone in building a scalable, multi-process ecosystem that supports the next decade of advanced device integration,” says Carlotta Baumann, CEO of Finetech.
A Multi-Process Gantry Platform for Semiconductor and Photonics Packaging
The gantry-style production die bonder delivers 3 micrometers placement accuracy and combines ultrasonic, adhesive and eutectic bonding with high-speed pick and place and dispensing in one system.
With up to four functional heads and dual heating plates, it handles complex high-mix assemblies without module changes and supports parallel preparation steps to substantially reduce cycle times.
Dies can be picked up from a source wafer stored in a 13-slot multi-wafer cassette, either face-up or in flip-chip orientation using the die-flip module. This full 12-inch wafer capability ensures compatibility with Chips Act and pilot-line requirements.
Automated loading and unloading of up to 12-inch wafers via SCARA robots and optional conveyor interfaces support full inline integration and continuous operation with minimal operator involvement.
Volume-Ready Die Bonding for Next-Generation Advanced Packaging
The die bonder platform aligns with emerging requirements in 3D packaging and heterogeneous integration in production environments across datacom, automotive, consumer electronics, medical technology, industrial sensing, defense and research.
Typical components include optical transceivers, LiDAR modules, SiC and GaN power devices, MEMS, radar modules, VCSELs, APDs, photonic chips, laser diodes, and HPC devices.
“Production teams want predictable output, short changeovers and value the ability to run different processes on one machine. This system was built to address exactly those needs, giving customers a practical path to reliable high-volume output,” says Melanie Schmidt, CSO at Finetech.
Software for Easy Setup and Flexible Changeovers
The system’s software supports both development and production environments by simplifying setup and reducing changeovers, all without the need for coding.
Intuitive workflow configuration, reusable recipes and automatic calibration help maintain accuracy and process stability. Parameter monitoring and material tracking add transparency and support ongoing process optimization.
Developing a Scalable Path from Prototype to High-Volume Production
As development progresses, the beta prototype serves as the starting point for Finetech’s next-generation production die bonder. With an expanding feature set and a roadmap shaped by customer feedback, the platform is being built to support a smooth transition from process development to repeatable, scalable and transferable high-volume manufacturing of semiconductor and photonics devices.
Its underlying system design, together with a wide portfolio of modular options, comes together to form a purpose-built production platform for advanced packaging requirements.
