Accessory Systems
As a complement to our advanced rework equipment, or on their own, these rework accessory systems provide unique pre-heating, reballing and desoldering solutions.
辅助系统
![](https://finetech-china.com/wp-content/uploads/2022/11/csm_HOTBEAM04_d0437ffc1c.jpg)
Hot Beam 04
Infrared underheater: 500 W heating power for the efficient and precise heating of PCBs. Unique features include a very compact design, fast response and targeted heating.
![](https://finetech-china.com/wp-content/uploads/2022/11/csm_HOTBEAM05_4776b20368.jpg)
Hot Beam 05
Infrared underheater: 2,000 W heating power to heat heavy PCBs. Unique features include a very compact design, large power density and a fast response heating source.
![](https://finetech-china.com/wp-content/uploads/2022/11/csm_HOTPLATE04_56b2f145e9.jpg)
Hot Plate
HOT PLATE 04 is a powerful 700 W conductive underheater that allows efficient work on heavy electrical systems with a flat bottom surface and LED PCBs.
![](https://finetech-china.com/wp-content/uploads/2022/11/csm_MINIOVEN_05_fd934515d4.jpg)
MiniOven 05
The MINIOVEN 05 is a robust, compact table-top system designed for easy re-balling of BGA components and pre-bumping of QFN components.
![](https://finetech-china.com/wp-content/uploads/2022/11/csm_Smart_Desolder_01_8aa9f62b79.jpg)
Smart Desolder 01
Non-contact extraction of residual solder using a manual hot-gas source with a vacuum pen. Remove components without re-applying heat and pressure to PCB.
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