Production Die Bonder for High-Mix Volume Die Bonding
March 2026 – Check out this video of the upcoming high-mix volume die bonding platform currently in development at Finetech. The calibration pick and place dry cycle is to test and ensure reliable 3 micron placement accuracy across the entire work area. Also shown is wafer loading from the new multi-slot wafer magazine, as well as die pick-up from the die eject module.
Stay tuned for more videos as development continues.
Complex Microsystems Assembly at Scale: How Advanced Packaging Is Shaping the Next Generation of Production Die Bonders
March 2026 – Advanced packaging is moving toward larger wafer formats, higher integration density, and more complex device architectures. As photonic modules, power devices, and heterogeneous packages add new layers of process complexity, production stability is becoming a defining capability for manufacturers scaling assemblies beyond R&D into reliable volume production.
At the same time, expectations are shifting toward automated workflows and 12-inch compatible manufacturing, driven by new fab and pilot line investments worldwide. Production environments must handle more materials, more bonding processes, and tighter tolerances while maintaining yield and repeatability.
We began asking a simple question: what would a production die bonder look like if it were designed from the start to manage this variability without sacrificing stability? That question led to the development of our next-generation production die bonding platform.
At the same time, expectations are shifting toward automated workflows and 12-inch compatible manufacturing, driven by new fab and pilot line investments worldwide. Production environments must handle more materials, more bonding processes, and tighter tolerances while maintaining yield and repeatability.
We began asking a simple question: what would a production die bonder look like if it were designed from the start to manage this variability without sacrificing stability? That question led to the development of our next-generation production die bonding platform.
Finetech Unveils Beta Prototype of Next-Generation High-Volume Production Die Bonder
February 2026 – Following an exclusive first look at Productronica 2025, Finetech has officially unveiled the beta prototype of its next-generation production die bonder platform. The modular system supports multiple bonding technologies and 12-inch wafers, enabling manufacturers to consolidate diverse advanced packaging processes in a single platform.
The automated production die bonder is designed for stable, repeatable assembly workflows through a flexible architecture supporting C2S, CoB, C2C and C2W processes, using 12-inch wafers as both source and target. This enables semiconductor, photonics and sensor manufacturers to address demanding applications in advanced 2.5D and 3D packaging, heterogeneous integration, hybrid bonding and direct bonding.
Development continues to evolve with customer feedback and real production requirements. Increasing expectations for yield, quality and high-volume output are driving demand for scalable, automation-ready systems capable of handling new materials and more complex assembly architectures.
The automated production die bonder is designed for stable, repeatable assembly workflows through a flexible architecture supporting C2S, CoB, C2C and C2W processes, using 12-inch wafers as both source and target. This enables semiconductor, photonics and sensor manufacturers to address demanding applications in advanced 2.5D and 3D packaging, heterogeneous integration, hybrid bonding and direct bonding.
Development continues to evolve with customer feedback and real production requirements. Increasing expectations for yield, quality and high-volume output are driving demand for scalable, automation-ready systems capable of handling new materials and more complex assembly architectures.
New Production Die Bonder: Exclusive First Look at Productronica 2025
October 2025 – At Productronica 2025, Finetech presents next-generation die bonding solutions. A key highlight will be an exclusive first look at Finetech’s new production platform, currently in development for high-mix die attach at scale.
The system features automated wafer and die handling on a high-precision gantry, enabling efficient, repeatable workflows and supporting scalable manufacturing. It is being designed to incorporate ultrasonic bonding as its initial process capability and provides an open platform architecture to accommodate diverse process requirements.
Visitors will have the opportunity to preview the concept and share direct feedback, helping to shape the platform’s final design.
The system features automated wafer and die handling on a high-precision gantry, enabling efficient, repeatable workflows and supporting scalable manufacturing. It is being designed to incorporate ultrasonic bonding as its initial process capability and provides an open platform architecture to accommodate diverse process requirements.
Visitors will have the opportunity to preview the concept and share direct feedback, helping to shape the platform’s final design.
