Your Full-Cycle Solutions Partner for Quantum Computing Technologies
Quantum computing is transforming how we solve the world’s most complex problems. As quantum hardware moves from prototypes to scalable products, assembly precision becomes critical — especially for superconducting qubits at cryogenic temperatures. Finetech delivers the accuracy, process control, and reliability needed to protect qubit coherence and enable scale.
Why Indium Bump Interconnect (IBI) Bonding?
To scale quantum computers, qubit coherence must be preserved across millions of interconnects. At millikelvin temperatures, even small bond or alignment errors can shorten coherence times, introduce thermal stress, and create noise.
Advanced packaging is critical — requiring precise material integration, ultra-accurate signal routing, and exceptional thermal stability. Conventional interconnects fall short, making specialized methods like Indium Bump Interconnect essential for superconducting qubits.
Cryogenic stability – Indium’s ductility and superconducting compatibility (Nb, Al, NbN) mitigate CTE mismatch.
High precision – Sub-micron flip-chip bonding technique delivers consistent, low-loss interconnects.
Reliability – Stable under high currents and repeated cryogenic cycling ensuring consistent qubit performance over time.
Building quantum computing hardware demands more than advanced die attach equipment. That’s why we provide high-precision die bonders,and process development expertise for a comprehensive solution tailored to your specific application.
Our Solution
FINEPLACER® femto 2 – Precision Bonding for Quantum Computing Manufacturing
The femto 2 delivers sub-micron placement accuracy and process flexibility designed for the unique demands of quantum processors assembly. From R&D to pilot production, it ensures precise, reliable bonding of the most delicate components in scalable quantum computing workflows.
🔬 Unmatched accuracy
⚙️ Scalability
🛡 Industry-leading yield
Engineering Reliability for Quantum Computing Scale
Sub-micron precision and cryogenic stability drive every Finetech solution – discover how we safeguard qubit performance at scale.
Sub-micron alignment & <1 µm co-planarity control ensure uniform bondline thickness
Industry-leading yield rate >99% lowers cost of quantum device manufacturing
Flexible IBI bonding processes: cold/thermal compression, oxide reduction, reflow
Precise force & temperature management (<1K accuracy) for maximum process control
Controlled N₂ / formic acid environment for clean, reliable bonds
Standardizing Indium Interconnects for Scalable Superconducting Qubits
Superconducting quantum processors scaling past 100 qubits are manufactured at the Walther-Meißner-Institut with the trusted FINEPLACER® femto 2, using Finetech’s Indium Bump Interconnect bonding process to deliver stable, reproducible results under extreme cryogenic conditions.
Precision Bonding Across Quantum Computing Technologies
No matter your quantum architecture, whether superconducting qubits, trapped-ion qubits, photonic qubits, neutral atom qubits, spin qubits, or topological qubits, Finetech brings over 30 years of advanced packaging expertise. With precision equipment, tailored in-house processes and a wide range of bonding methods, we help you move from research to scalable quantum production with reproducible results.
Indium Bump Interconnect
Thermo-Compression Bonding
Adhesive Bonding / UV Curing
Ultrasonic Bonding
Laser-Assisted Bonding / Eutectic Bonding
