The Efficient Solution for Advanced Packaging
Automatic Multi-Purpose Bonder
The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus on reduced cost-per-bond and higher UPH.
With specifications such as a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low to high bonding force capability, this model is perfectly suited to dynamic assembly of photonics, power electronics and sensors.
Designed for high-yield production tasks, the FINEPLACER® femto pro supports a wide spectrum of advanced die attach technologies, including laser- assisted bonding, ultrasonic bonding, adhesive bonding, thermo-compression as well as eutectic and reactive soldering.
Its complete machine enclosure ensures a stable process environment while protecting operators from gas, vapor, and UV radiation.
Equipped with IPM Command software, the FINEPLACER® femto pro provides an intuitive and structured interface for process development and safe production flow. The software enables synchronized control of all process parameters and additional modules, offering automated pattern recognition for precise substrate and component alignment.
Thanks to its modular and highly customizable design, the FINEPLACER® femto pro can be configured and upgraded in-field to meet evolving demands, making it a cost-effective and future-proof solution for the rapidly advancing assembly industry.
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Key Facts*
- Multi-chip capability
- Numerous bonding technologies (adhesive, soldering, thermocompression, ultrasonic)
- Wide range of controlled bonding forces
- Placement accuracy of 2 µm @ 3 Sigma
- Automatic placement accuracy calibration
- Safe and controlled process environment with cleanroom quality
- Various bonding technologies in one recipe
- Wide range of supported component sizes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Camera shifting for precision and wide field of view
- In-situ process observation in HD
- 3-color LED illumination
- Full process access and easy programming
- Data/media logging and reporting function
- Synchronized control of all process related parameters
- Modular machine platform allows in-field retrofitting during entire service life
- Ultra low bonding force
- Process module compatibility across Finetech platforms
- Individual configurations with process modules
- Integrated scrubbing function
- Fully automatic and manual operation
- Automatic tool management
- Wide range of component presentation (wafer, waffle pack, Gel-Pak®)
- Large bonding area
- Excellent price performance ratio
*depending on configuration
Applications & Technologies
With a broad range of supported applications and technologies, our die bonding systems are ready to tackle any application challenge in the industry. And as market requirements shift and new technologies emerge, their modular hardware and software architecture ensures maximum technological versatility over the entire service life.
Functions - Modules - Enhancements
Our die bonding solutions are as individual as our customers’ requirements and offer a wide range of configuration options. In addition to the system’s basic functions, which are part of the standard functional range, numerous process modules are available for each system, expanding the spectrum of applications. Retrofittable at any time, they enable additional die bonding technologies and processes either directly or as part of a module package. A selection of functional enhancements and accessory systems make daily work with the die bonder easier and help to make certain technology and process sequences even more efficient.
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