On May 17, 2018, around 50 European professionals from industry and science followed our invitation to join the Micro Assembly Day 2018. This annual one-day conference in Berlin is a platform for active knowledge-sharing and an exchange of experience on the latest trends in advanced packaging and micro assembly.
Things kicked off with a get-together dinner on the eve of the Micro Assembly Day where our guests had the chance to meet and break the ice. Sitting at the Humboldt Terrassen restaurant in Berlin-Mitte, enjoying good talks while taking in the impressive sight of the Berlin Cathedral, was the perfect start. Another highlight was a guided tour at the Humboldt-Box information center that gave us a better understanding of the enormous efforts to rebuild the world famous Berlin City Palace.
On the next morning, we reunited at the Finetech headquarters for a series of presentations covering a wide spectrum of topics. Numerous guest speakers provided insights into their latest application solutions and new technological achievements and gave examples of practical implementations in different industries and markets. Meanwhile, Finetech Product Managers presented exclusive previews of upcoming hardware and software solutions for our high-accuracy die bonder line.
A recurring theme during the Micro Assembly Day was the transition of R&D processes into automated manufacturing. In line with Finetechs “From Lab to Fab” approach, many presentations and discussions involved strategies to scale up challenging high-accuracy applications to meet the requirements of automated series production.
We would like to say thank you to all our visitors, speakers and Finetech staff that contributed to making this year’s Micro Assembly Day a success and hope to see you again soon.
05/22/2018, created by: Daniel Staubach