André Thiemann appointed Co-CEO alongside Carlotta Baumann
Berlin, November 3, 2026 – Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1. Together with CEO Carlotta Baumann, he will further develop Finetech as a partner for scaling packaging processes into volume manufacturing.
Finetech is further expanding its portfolio for volume production, with a particular focus on applications in photonics, quantum technology and the semiconductor industry. This gives customers a continuous path from collaborative process development through prototyping to volume production, on a unified technology platform and without process requalification.
With André Thiemann, Finetech gains a manager whose experience in optimizing manufacturing and processes based on customer requirements directly supports this strategy. He brings more than 15 years of experience in industrial manufacturing, operations management and building global production networks.
Most recently, as Vice President Future Operations at Nikon SLM Solutions, he was responsible for the global operations strategy with a focus on efficiency, scalability and competitiveness. His previous roles include Managing Director of Nikon SLM Solutions Service GmbH & Co. KG and Vice President Production. In these positions, he led production and service organizations and set up a new assembly site in the USA. He also drove strategic make-or-buy decisions to adapt manufacturing capacity flexibly to demand.
“Finetech has a strong technological foundation. Now it’s about enabling our customers to move into volume production even faster and more reliably. That is what I am working on together with Carlotta Baumann and the entire team,” says André Thiemann.
Carlotta Baumann, CEO of Finetech: “Our customers come to us with innovations they want to bring into volume production. That is what we are aligning Finetech to. André Thiemann has built and scaled production structures internationally. That is the experience we need for this step.”
About André Thiemann
André Thiemann holds a master’s degree in mechanical engineering from Paderborn University. At Nikon SLM Solutions, his path led from customer and application projects through business development and global application responsibility to leadership positions in production, service and operations. Along the way, he built teams and production structures in Europe, North America and Asia. Thiemann is a certified Six Sigma Green Belt and Black Belt.
About Finetech
Finetech is a leading supplier of high-precision die bonding equipment and process development for advanced packaging and heterogeneous integration, enabling technology innovation in semiconductor, quantum and photonics. The portfolio ranges from manual and semi-automated bonders for R&D and prototyping to fully automated production systems. As all die bonders share a unified hardware and software platform, processes developed in the lab can transfer directly to volume production, which helps customers accelerate their go-to-market while reducing scale-up risk. Supported technologies include thermocompression, eutectic, adhesive, ultrasonic, laser-assisted and hybrid bonding with sub-micron placement accuracy. Finetech also supplies SMD rework systems for electronics manufacturers and EMS providers.
Its world-wide customer base includes start-ups as well as global technology leaders. Headquarters are in Berlin, Germany, with subsidiaries in the USA, Southeast Asia and Japan and a network of sales partners around the world.
